CVE-2017-18157 (mdm9206_firmware, mdm9607_firmware, mdm9650_firmware, msm8909w_firmware, msm8996au_firmware, sd_205_firmware, sd_210_firmware, sd_212_firmware, sd_415_firmware, sd_425_firmware, sd_450_firmware, sd_615_firmware, sd_616_firmware, sd_625_firmware, sd_650_firmware, sd_652_firmware, sd_820_firmware, sd_820a_firmware, sd_835_firmware, sd_845_firmware, sdx20_firmware)

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Source: NIST
CVE-2017-18157 (mdm9206_firmware, mdm9607_firmware, mdm9650_firmware, msm8909w_firmware, msm8996au_firmware, sd_205_firmware, sd_210_firmware, sd_212_firmware, sd_415_firmware, sd_425_firmware, sd_450_firmware, sd_615_firmware, sd_616_firmware, sd_625_firmware, sd_650_firmware, sd_652_firmware, sd_820_firmware, sd_820a_firmware, sd_835_firmware, sd_845_firmware, sdx20_firmware)

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